- Meaglow’s hollow cathode plasma source (featuring low oxygen contamination, high radical production and low plasma damage).
- 4” or 8” substrates , other sizes possible.
- Patented high temperature pulse processes.
- Superior nitride deposition.
- No short circuiting of plasma source.
- Carbon reduction techniques (patents pending).
- Plasma and thermal ALD during the same run.
- UHV compatibility.
- Computer control.
- Temperatures and processes to > 6500C.
- Optional process pressure control.
- Options for atomic layer etching.
- Optional substrate biasing.
- Customised solutions.
