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  • Meaglow’s hollow cathode plasma source (featuring low oxygen contamination, high radical production and low plasma damage).
  • 4” or 8” substrates , other sizes possible.
  • Patented high temperature pulse processes.
  • Superior nitride deposition.
  • No short circuiting of plasma source.
  • Carbon reduction techniques (patents pending).
  • Plasma and thermal ALD during the same run.
  • UHV compatibility.
  • Computer control.
  • Temperatures and processes to > 6500C.
  • Optional process pressure control.
  • Options for atomic layer etching.
  • Optional substrate biasing.
  • Customised solutions.
Upgrade Your Plasma Source Today!